Phone: +86-133 5263 6504
Phone: +86-133 5263 6504
Understanding BGA Underfill Epoxy Adhesive Ball Grid Array (BGA) underfill epoxy adhesive is a specialised material used in the electronics industry to enhance the reliability and performance of BGA packages. These adhesives fill the space between a BGA chip and…
BGA Underfill Epoxy Adhesive: A Comprehensive Guide Ball Grid Array (BGA) technology has revolutionized electronic packaging by enabling higher density and improved performance in integrated circuits. However, this advancement brings challenges, particularly in reliability and durability. One critical solution to…