Potting Compound Products
Deepmaterial manufacturing the best potting compound & encapsulants products for various of industries.
Home > Product > Epoxy Adhesive

Epoxy Adhesive

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board.

Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing.

DeepMaterial’s flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application.

COB encapsulant can be used for wire bonding to provide environmental protection and increase mechanical strength. The protective sealing of wire-bonded chips includes top encapsulation, cofferdam, and gap filling. Adhe- sives with fine-tuning flow function are required, because their flow ability must ensure that the wires are encapsulat- ed, and the adhesive will not flow out of the chip, and ensure that can be used for very fine pitch leads.

DeepMaterial’s COB encapsulating adhesives can be thermally or UV cured DeepMaterial’s COB encapsulation adhesive can be heat cured or UV-cured with high reliability and low thermal swelling coefficient, as well as high glass conversion temperatures and low ion content. DeepMaterial’s COB encapsulating adhesives protect leads and plumbum, chrome and silicon wafers from the external environment, mechanical damage and corrosion.

DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer good high temperature stability and thermal shock resistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistance when cured.

Deepmaterial is best top waterproof structural adhesive glue for plastic to metal and glass manufacturer,supply non conductive epoxy adhesive sealant glue for underfill pcb electronic components,semiconductor adhesives for electronic assembly,low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material and so on.

DeepMaterial Epoxy Resin Base Chip Bottom Filling And Cob Packaging Material Selection Table
Epoxy Underfill Product Selection

Product SeriesProduct nameTypical application of the product
Epoxy UnderfillDM-6308A one-component epoxy primer for the manufacture of LED splicing screen in COB packaging process. The product has low viscosity, good adhesion and high bending strength, which can quickly and effffectively fifill the tiny gap between chips and effffectively enhance the reliability of chip mounting.
DM-6303A one-component epoxy primer for the manufacture of LED splicing screen in COB packaging process. The product has low viscosity, good adhesion and high bending strength, which can quickly and effffectively fifill the tiny gap between chips and effffectively enhance the reliability of chip mounting.
DM-6322A one-component epoxy primer for the manufacture of LED splicing screen in COB packaging process. The product has low viscosity, good adhesion and high bending strength, which can quickly and effffectively fifill the tiny gap between chips and effffectively enhance the reliability of chip mounting.

 

OLED Edge Banding Product Selection

Product SeriesProduct nameTypical application of the product
EpoxySealantsDM-6930A one-component low temperature curing epoxy sealant, designed for edge sealing of OLED display, with extremely low water vapor transmittance and moisture resistance, can effffectively improve the life of OLED display, and can also be used for edge sealing of electronic paper display (ink screen).
DM-6931A one-component low temperature curing epoxy sealant, designed for edge sealing of OLED display, with extremely low water vapor transmittance and moisture resistance, can effffectively improve the life of OLED display, and can also be used for edge sealing of electronic paper display (ink screen).

 

Cold-pressed Packaging Adhesive Product Selection

Product SeriesProduct nameTypical application of the product
Two-component epoxy adhesiveDM-6986A two-component epoxy adhesive, specially designed for the integrated induction cold pressing process, has high strength, excellent electrical performance and strong versatility.
DM-6988A two-component high-solid epoxy adhesive, specially designed for the integrated induction cold pressing process, has high strength, excellent electrical performance and strong versatility.
DM-6987A two-component epoxy adhesive specially designed for the integrated induction cold pressing process. The product has high strength, good granulation characteristics and high powder yield.
DM- 6989A two-component epoxy adhesive specially designed for the integrated induction cold pressing process. The product has high strength, excellent cracking resistance and good aging resistance.

 

Hot-pressed Packaging Adhesive Product Selection

Product SeriesProduct nameTypical application of the product
Two-component epoxy adhesiveDM-6997A two-component epoxy adhesive specially designed for the integrated induction hot-pressing process. The product has good demoulding performance and strong versatility.
DM-6998A two-component epoxy adhesive specially designed for the integrated induction hot-pressing process. This product has good demoulding performance, high strength and excellent heat aging resistance.

 

NR Magnetic Adhesive Product Selection

Product SeriesProduct nameTypical application of the product
Two-component epoxy adhesiveDM-6971A one-component epoxy adhesive specially designed for NR inductance coil encapsulation. The product has smooth dispensing, fast curing speed, good molding effffect, and is compatible with all kinds of magnetic particles.

 

High Temperature Resistant Insulating Coating Product Selection

Product SeriesProduct nameTypical application of the product
Three-component epoxy adhesiveDM-7317DM-7317 is a three-component high-temperature insulation special coating, which is suitable for the surface protection of various magnetic components. It is specially designed for the roll spray process and has excellent high-temperature resistance and insulation performance.